PCB reliability test is an important link in optical communication industry chain. During the optical fiber communication, optical fiber laser industry rapid development, The customer need to change with each passing day and more changes. Wewon Tech will provides convenience for customers who can not afford expensive cost of European and American equipment, who has limited budget.
Wewon is committed to supporting high-end product development, manufacturing and testing for optical communications customers. Deep layout of the global market, Provide pre – sales and after – sales technical support to customers. Thermal cycling test equipment from Wewon has broke the long – held monopoly on imported temperature forcing systems, Especially the imported famous brands from the United States. The thermal cycling testing machine from Wewon Tech is a limit performance test for rapidly temp change.
In the process of design and application, the product is constantly subjected to pcb thermal testing of its own and external climate and mechanical environment, but still needs to be able to work normally. This needs to be verified with thermal cycling test systems. This verification is basically divided into three parts: research and development test, trial production test and mass production sampling test.
Semiconductor reliability tests are conducted before or during mass production of products, To ensure the quality and reliability of the products put into mass production, The study of product failure mode is of great significance to improve production technology, quality of supplied materials and design. PCB reliability test is used in almost all electronic devices. The main function of PCB is to connect with each other.
IC welding to PCB, IC is integrated in the chip general purpose circuit, it is a whole. Once the inside is damaged, the chip will be damaged. The goal of printed circuit boards (pcbs) is to connect IC and discrete components to form a larger working circuit. Thermal cycling equipment can detect the defects and hidden dangers of welding components in the production process, decreasing failure rate. When it fails, components can be replaced in time
Semiconductor PCB reliability testing include aging test, temperature and humidity test, gas corrosion test, mechanical vibration test, mechanical impact test, impact test and drop test, dustproof and waterproof test and package pressure test. Please refer the below table with thanks !
Thermal cycling test equipment for semiconductor PCB reliability test is an important factor to reflect the competitiveness of enterprises. As electronic products from automotive component manufacturers become more complex, Its reliability problems caused by high after – sales maintenance rate on the negative impact of enterprise brand, And large – scale after – sales maintenance service expenditure of huge costs. Many enterprises pay more and more attention to choose automatic test equipment for semiconductor reliability testing.
By virtue of advanced reliability engineering technology with failure physics as the core, As well as a group of master these thermal cycling test technologies and experience of the young and old engineers and technicians. The laboratory provides enterprises with reliability growth technical services aimed at reducing the rate of product maintenance.
Wewon is committed to supporting high-end product development, manufacturing and testing for optical communications customers. Deep layout of the global market, Provide pre – sales and after – sales technical support to customers. Thermal cycling test equipment from Wewon has broke the long – held monopoly on imported temperature forcing systems, Especially the imported famous brands from the United States. The thermal cycling testing machine from Wewon Tech is a limit performance test for rapidly temp change.
In the process of design and application, the product is constantly subjected to pcb thermal testing of its own and external climate and mechanical environment, but still needs to be able to work normally. This needs to be verified with thermal cycling test systems. This verification is basically divided into three parts: research and development test, trial production test and mass production sampling test.
Semiconductor reliability tests are conducted before or during mass production of products, To ensure the quality and reliability of the products put into mass production, The study of product failure mode is of great significance to improve production technology, quality of supplied materials and design. PCB reliability test is used in almost all electronic devices. The main function of PCB is to connect with each other.
IC welding to PCB, IC is integrated in the chip general purpose circuit, it is a whole. Once the inside is damaged, the chip will be damaged. The goal of printed circuit boards (pcbs) is to connect IC and discrete components to form a larger working circuit. Thermal cycling equipment can detect the defects and hidden dangers of welding components in the production process, decreasing failure rate. When it fails, components can be replaced in time
Semiconductor PCB reliability testing include aging test, temperature and humidity test, gas corrosion test, mechanical vibration test, mechanical impact test, impact test and drop test, dustproof and waterproof test and package pressure test. Please refer the below table with thanks !
| Test Categories | Introduction of Thermal Cycling Test Equipment for Semiconductor PCB Reliability Test | Test Requirements and Technical Parameters |
| High Temperature Test | Generally, The product life will be reduced to a quarter for every 10℃ increase in the surrounding environment. When the ambient temperature rises by 20℃, the product life will be reduced by half. The product life follows the “10℃ rule”. Therefore, high temp test, as the most commonly used test, is used for the screening of components and whole machine, aging test, life test, accelerated life test, and plays an important role in the validation of failure analysis. | High temperature has many influences on products, such as aging, oxidation, chemical change, thermal diffusion, electromigration, metal migration, melting, vaporization deformation, etc. |
| Test Range: < 200℃, Test Parameters: Less than 1m³, 16m³ | ||
| Ultra-low Temperature Test | Low temperature has a lot of influences on products, such as embrittlement, freezing, increase of viscosity, curing, reduction of mechanical strength and physical shrinkage, etc. Low temperature test is used to assess the adaptability of products in low temp environment for storage and use, and is often used in product type test and component screening test in the development stage. | Test Range: 0℃ ~ -70℃︱-40 ℃ ~ 70 ℃ |
| Test Parameters:Less than 1m³ 1m³ 18.9m³ | ||
| Test Parameters:No request | ||
| Damp Heat Test | Damp heat test is used to simulate the environment of a tropical rain forest to determine the suitability of products and materials for use and storage in the face of temperature changes and condensation on the surface of products. Thermal cycling test equipment often used in life test, evaluation test and comprehensive test. | Test Range: Temperature:- 70 ℃ ~ 180 ℃︱Humidity: 5% ~ 98% |
| Test Parameters:Less than 1m³, 1m³, 18.9m³ | ||
| Humidity < 20% ( Low temperature ≥ -40℃) | ||
| Temperature Humidity Test | The influence of humidity on product failure is more than 40%, so humidity test is essential in environmental test.It is often used in life test, evaluation test and comprehensive test, and plays an important role in failure analysis.This test is especially necessary for product development and quality evaluation of products containing resin materials. Often do double 85 refers to the temperature 85℃, humidity 85%RH. | Temperature humidity environment, Temp residence time |
| Temperature: 70 ℃ ~ 180 ℃︱Humidity:5% ~ 98% Humidity < 20% | ||
| Test Parameters: Less than 1m³, 1m³, 18.9m³ | ||
| Thermal Shock Test | The purpose of the thermal shock test is to confirm the change of product characteristics in a relatively short period of time and the failure problems caused by the different thermal expansion coefficients of the components.These changes can be observed by rapidly alternating exposure of components to ultra-high and ultra-low temperatures.The cold and heat shock is different from the environmental simulation test, it is to find the potential fault which is difficult to find under normal temp by the cold and heat temperature shock. | Test Range: Temperature: -75~ 220℃ |
| Conversion Time: < 10 Seconds | ||
| Test Parameters: 770* 650* 610mm | ||
| Rapid Temperature Change Test | Rapid temperature change is a temperature change that specifies the rate of temperature change. It is often used to simulate the environment in regions with large temperature difference between day and night. It can also be used in life tests to assess the appearance, mechanical properties and electrical properties of components or products. | Test Range: Temperature, -70℃ ~ 150℃ |
| Test Parameters: Temperature change rate ≤10℃/ minute | ||
| The rate of temperature change is 10℃ ~ 25℃/ min | ||
| Low Pressure Test | Low pressure test chamber is mainly used in aviation, aerospace, information, electronics and other fields to determine the environmental adaptability and reliability test of instruments, electrical products, materials, parts and equipment under low pressure, high temperature, low temperature single or simultaneous action. | Test Scope: Pressure, Atmospheric pressure ~10KPa |
| Temperature: At ambient temp to 200 ℃ | ||
| Test Parameters: 1 Cubic | ||
| Ozone Aging Test | Ozone aging test is suitable for testing the ozone aging resistance and aging cracking of nonmetallic and organic rubber products (such as coatings, paints, rubber, plastics and their products). | Test Range: Concentration: 0~ 500 pphm> |
| Temperature: Ambient Temp ~ 50℃ | ||
| Test Parameters:550 * 500 * 700 mm | ||
| Pressure Cooker Test | High pressure cooking test adopts high pressure and high humidity conditions to assess the comprehensive influence of electronic devices such as semiconductor integrated circuits encapsulated in plastic. It is used to evaluate the humidity and heat resistance of electronic products in a high acceleration test mode, and is often used in product development, quality assessment and failure verification. | Test range: Temperature: 105 ~ 142.9℃︱Humidity: 75% ~ 100% |
| Pressure: 0.02 ~ 0.186 Mpa | ||
| Test Parameters: 400* 280* 270mm | ||
| Dustproof and Waterproof Test | The dustproof and waterproofing test is mainly aimed at electronic products and equipment in outdoor or harsh environment. The representation is IPXX. The first characteristic number represents the protection level against access to dangerous parts and solid foreign bodies, while the second characteristic number represents the protection level against water entry. | Scope of Test: IP XX |
| Test Parameters: Dustproof: 1~4X︱5 ~ 6 X︱Waterproof: X1 ~ 7 | ||
| Ultraviolet Aging Test | Used thermal cycling test equipment to simulate the damage effect of sunlight, humidity and temperature on the material; Aging of materials includes fading, loss of light, reduction of strength, cracking, peeling, pulverization and oxidation. | Test Scope: UVA340, UVB313, UVA351 |
| Test Parameters: A single sample size of 6*9cm | ||
| Xenon Lamp Aging, Sun Radiation | Using xenon arc lamps to reproduce destructive light waves in different environments can provide environmental simulation and acceleration tests for scientific research, product development and quality control. | Test Range: The blackboard temperature range is 25℃ ~ 90℃ |
| Test Parameters: WEW-500-XD | ||
| Gas Corrosion Test | Gas corrosion is mainly applied to contact points and connectors. The evaluation standard after test is contact resistance change, followed by appearance change.The main corrosive gases are sulfur dioxide, hydrogen sulfide, nitrogen dioxide and chlorine. One or more gases can be selected according to the use environment. | Test Scope: SO2/ H2S/ NO2/ Cl2 |
| Concentration: 0.01~ 100ppm︱Temperature: 0℃ ~ 90℃︱Humidity: 10% ~ 98% | ||
| Test Parameters: 870*735*520mm | ||
| Salt Spray Fog Test | The salt spray test simulates the climate of the ocean or humid area and is used to test the ability of products, materials and their protective layers to resist salt spray corrosion.There are two kinds of salt spray test and alternating salt spray test. It is often used for quality assessment and failure verification under special conditions. | Scope Of Test: NSS, AASS, CASS |
| Test Parameters: 900* 600 mm︱2400* 1500 mm | ||
| Test Parameters: 1 m³ |
Thermal cycling test equipment for semiconductor PCB reliability test is an important factor to reflect the competitiveness of enterprises. As electronic products from automotive component manufacturers become more complex, Its reliability problems caused by high after – sales maintenance rate on the negative impact of enterprise brand, And large – scale after – sales maintenance service expenditure of huge costs. Many enterprises pay more and more attention to choose automatic test equipment for semiconductor reliability testing.
By virtue of advanced reliability engineering technology with failure physics as the core, As well as a group of master these thermal cycling test technologies and experience of the young and old engineers and technicians. The laboratory provides enterprises with reliability growth technical services aimed at reducing the rate of product maintenance.
At present, printed circuit boards are still the main assembly method for electronic equipment and systems. Practice has proved that even if the circuit schematic design is correct, the semiconductor reliability testing is improper, It can also adversely affect the reliability of electronic equipment. For example, if two thin parallel lines on a printed board are close together, a delay in the signal waveform will be formed. PCB thermal analysis for reflection noise is formed at the end of the transmission line. Therefore, attention should be paid to the correct method when designing thermal cycling test systems.
Reliability testing involves exposing a product to natural or artificial environmental conditions, To evaluate the performance of the product under the environmental conditions of actual use, transportation and storage, Analyze and study the influence degree and action mechanism of environmental factors. Reliability testing for semiconductor ics is to ensure that the product lasts for a specified period of time. Under all circumstances of intended use, transport or storage, Activities performed to maintain functional reliability.
Reliability testing involves exposing a product to natural or artificial environmental conditions, To evaluate the performance of the product under the environmental conditions of actual use, transportation and storage, Analyze and study the influence degree and action mechanism of environmental factors. Reliability testing for semiconductor ics is to ensure that the product lasts for a specified period of time. Under all circumstances of intended use, transport or storage, Activities performed to maintain functional reliability.
| Ambient to +125℃ | ＜ 10.0 minutes |
| +125℃ to Ambient | ＜ 10.0 minutes |
| -40℃ to Ambient | ＜ 3.0 minutes |
| Ambient to -40℃ | ＜ 11.0 minutes |
| Uniformity Range | 2.0℃ Range from Setpoint |
High temperature, low temperature, high humidity and temperature changes in the climate environment are simulated by using various environmental test chambers. To accelerate the reaction of the semiconductor testing in the use environment to verify whether it meets the quality objectives expected in the research and development, design and manufacturing. Thus the whole product is evaluated to determine the reliability life of the product. Different test environment conditions will have different effects on the semiconductor automatic test equipment (ATE) and cause different failures.
For example: (1) Under the condition of high temperature semiconductor reliability testing, the device of the product has the following influence on aging, gasification, cracking, softening, melting, expansion and evaporation. The corresponding automobile will appear the circuit system insulation is bad, the mechanical failure, the mechanical stress increase. (2) Under the condition of low temperature thermal cycling and environmental stress testing, the devices of the products have the following influences: embrittlement, freezing, shrinkage and solidification, mechanical strength reduction, etc. Corresponding car will appear circuit system insulation is bad, crack mechanical failure, seal failure and so on.
For example: (1) Under the condition of high temperature semiconductor reliability testing, the device of the product has the following influence on aging, gasification, cracking, softening, melting, expansion and evaporation. The corresponding automobile will appear the circuit system insulation is bad, the mechanical failure, the mechanical stress increase. (2) Under the condition of low temperature thermal cycling and environmental stress testing, the devices of the products have the following influences: embrittlement, freezing, shrinkage and solidification, mechanical strength reduction, etc. Corresponding car will appear circuit system insulation is bad, crack mechanical failure, seal failure and so on.