Semiconductor Test Equipment for Probe Card Manufacturing

Probe card manufacturing need the semiconductor test equipment. When we designed the thermal testing equipment, Only some commonly used test items are packaged into the IC tester, and the logic function of the verification chip is implemented in a fixed test mode. But as chip products diversify, Some thermal inducing system can no longer do it alone, For example, some chips have random codes, After the random code is obtained, the encryption algorithm is run, The instructions to the chip can then be calculated.

Why the probe card manufacturing need semiconductor test equipment ? In recent years, Semiconductor probes manufacturing technology has advanced rapidly. Products are thin and short, IC volume is getting smaller, But functions are getting stronger, more feet, In order to reduce the area occupied by chip packaging and improve IC efficiency. Nowadays, Flip Chip packaging is widely used in graphics chips, chipsets, memory and CPU.

Meanwhile, the instructions of different IC chips are different, As a result, the fixed test mode of the existing probe card manufacturer cannot realize good adaptability. The unit price of high – order packaging is high, If the chip can be tested before packaging, When a defective product is found in the wafer, it is marked. Remove these marked defective items until the end of the packaging process, Then you can save unnecessary packaging costs.

semiconductor test equipment

Wafer probe card is an important test and analysis interface indispensable for semiconductor fabrication. By connecting the temperature cycling chamber and the chip, the chip parameters are tested by transmitting signals. Wafer probe card are widely used for test of memory IC (DRAM, SRAM, Flash) logic IC, consumer IC, drive IC, communication IC, power management IC, electronic instrument and medical device IC. It is a rather subtle link in the semiconductor industry.

Use the semiconductor test equipment for probe card manufacturing. The main purpose are : (1) The qualified chip is identified before the wafer is sent to the packaging plant. (2) The electrical properties of the device/circuit are evaluated. Engineers need to monitor the distribution of parameters to maintain the quality level of the process. (3) The accounting of qualified and defective chips provides overall performance feedback to wafer production personnel. The position of qualified chips and defective items on the wafer is recorded on the computer in the form of a wafer chart.

production area of semiconductor test equipment

Nowadays, Wafer testing is one of the main methods to measure chip yield. So use thermal cycling chamber for probe card manufacturing is important. As the size and density of the chip increases, wafer testing becomes more and more expensive. As a result, chips require longer test times and more sophisticated power supplies, semiconductor test equipment and computer systems to perform the tests and monitor the results.

Visual inspection systems have also become more sophisticated and expensive as chips have grown in size. Chip designers were asked to introduce test patterns into the storage array. Test designers are exploring how to make the test process simpler and more efficient, For example, use simplified temperature forcing system after chip parameters have been evaluated. Semiconductor test equipment is also possible to interlace the chips on a wafer, or to test multiple chips simultaneously.

quality check for semiconductor test equipment before shipping

The significance of semiconductor test equipment in detecting probe card: Contact the probe on the probe card directly with the solder pad or bump on the chip, Lead out chip signal, Then cooperate with peripheral semiconductor testing equipment and software control to achieve the purpose of automatic measurement.

Probe card are used before IC packaging, Function test of bare crystal system with probe to screen out defective products, Then carry out the subsequent packaging engineering, Therefore, Probe card is one of the most important processes in IC manufacturing which has great influence on manufacturing cost.

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